Lian Li Lancool III Mesh Black ARGB E-ATX motherboard supported Mid Tower Tempered Glass Chassis

Features:

• Open the left and right side tempered glass panels by the aluminum door handles.
•  The top, front, and bottom of the case can each fit a 360mm radiator.
• The design of the storage trays has been revised to include modularity. Each unused HDD/SSD tray can be individually
  removed.
• New cable management design:  I.) 2 x Magnetic hinged back side cable covers, easier to open and still removable for unrestricted access. II.) 3+5 velcro channel straps : 4 small straps help route the CPU and fan cables, and another small one for shorter 24 pin cables, while 3 large ones are for the remainder of the cables. III.) Sliding front side cable cover (also can mount distro plate) By loosening a screw behind the motherboard tray, the bar can slide to adapt for wider motherboards and let the user customize the curve of their cables passing through.

Lancool III RGB includes 3 x 140 ARGB fans at the front and 1 x 140 PWM fan at the rear

Exterior design

Lancool III has a fine mesh top, front and lower sides panels. Opening the left and right tempered glass panels is easy with the front aluminum door handles.

3 x 360 Radiator

In the main chamber, the top, front, and bottom of the case can each fit a 360mm radiator.

Upgrade Cable management

Improved cable management includes the magnetic hinged rear cable covers, which are easier to open and removable for full access.

Eight velcro-channel straps are located in key points, with 4 around the rear CPU cutout for cable routing, a small one at the bottom for short 24-pin cables, and 3 large dual-layer straps are at the front.

Modular Storages Trays

The design of the storage trays has been revised to include modularity. Each unused HDD/SSD tray can be individually removed.

Specifications: